AI(Artificial intelligence) will be widely applied in Medical& Health, financial services, smart manufacturing, and the Internet of Things, helping enterprises and individuals more efficiency and decision-making.AI also can upgrate products and servicesso as to make social progress. Big data centers, GPU, CPU, DPU, ASIC,and FPGA, can support computing, data processing, and data security to back up AI development

MTM has launched high-performance, customized, and cost-effective advanced packaging solutions for AI and HPCproducts. The solutions covers FCBGA , hybrid (FC+WB), SiP packaging, chiplet and 2.5D/3D packaging, which all has mass production cases. The luanching way also includes industry-leading co-design of chip-packaging-system and multi-physical domain simulation services, maximizing chip performance and enhancing its core competitiveness.

Electric Cars products have become an important part of vehicles, playing an important role in improving driving safety, driver assistanceand In-vehicle infotainment. With the acceleration of  intelligent driving and new energy vehicles, ASIC package  for special automotive cars applications can bring  lower power consumption, smaller size, and better thermal management, while ensuring system nore stability, safety and reliability. This technology makes solid foundation for development of future automotive electronic products.

MTM has passed ISO 9001 and ISO/TS 16949, emphasized the entire automotive electronic supply chain, including production processes, supplier quality and customer satisfaction., All   ensure that product reliability and quality are in line. At the same time, the firm has released various plastic and ceramic packaging solutions to meet customers demand  of  high reliability,  performance,safety, and heat dissipation.

With the acceleration of industrialization course and production automation, demands of    industrial control booms, Industrial control is used in mechining, chemical engineering, mining, petroleum and pharmaceuticals.Now it begins to achieve digitization, networking and intelligence. 

The market prospect for new energy products is broad. With global energy crisis worsen,  need for new energy products increases, especially in energy production, transportation and construction. At the same time, government's policy for environmental protection and sustainable development also have a positive impact on new energy product

MTM continues to invest in research and development in industrial control and new energy, and has successfully given advanced packaging solutions for several leading enterprises. MTM’s team can offer high-quality turnkeys service from advanced packaging solution design to processing, which not only empowers customers products, but also update products in integration, reliability, low loss, high speed, thermal management and high cost-effectiveness

Smart Wearable, as a new product used for human-computer interaction, integrates  computing, communication,and entertainment. The devices have broad prospects and become very popular in today's society,  covering smart watches, Smartglasses, smart bracelets, VRand  AR. With  Internet of Things and 5G deveolpment,  market expansion of intelligent wearables and advanced cross-border  will further broaden intelligent wearables.

The advanced packaging solutions launched by MTM can help manufacturers surmount disadvantage for example size and power consumptionand maintaing high performance and  stability when designing and manufacturing smart wearable devices. SiP heterogeneous integration packaging process can upgrate intelligent wearable devices in better thermal management, faster signal transfer, lower power loss, higher reliability and customization .